V901
Materials for Reliable Protection of Electronics Circuitry Potting compounds cure tack free in seconds upon exposure to UV/Visible light, replacing epoxy urethane and silicone potting materials. Shallow potting and sealing of electronic components and cir
Specifications
UV-Curable Encapsulant & Potting Resin
encapsulant cures in seconds to enhance moisture, thermal cycle, and abrasion resistance of electronic and microelectronic assemblies. This material offers adhesion to various component substrates. This encapsulant provides optimal coverage over difficult circuit geometries. encapsulating material has high ionic purity, is solvent free, and isocyanate free. This encapsulant has been engineered to have a low modulus and low Tg to minimize stress on delicate wire bonds. Material exposed to light will cure in seconds, while any shadowed areas will cure upon heat exposure. Visible/UV light-curable encapsulant is formulated for fast on-demand cure with the LED Prime UVA spot curing lamp and BlueWave® LED DX-1000 curing system.
encapsulant is especially well suited for chip-on-board, chip-on-flex, multi-chip modules and wire bonding.
materials are solvent free and cure upon exposure to light. Their ability to cure in seconds results in lower processing costs. When cured with UV light curing spot lamps, focused beam lamps, flood lamps, or conveyor systems they deliver optimum speed and performance for maximum efficiency. lamps offer the optimum balance of UV and visible light for the fastest, deepest cures. This product is in full compliance with the RoHS Directives 2002/95/EC and 2003/11EC.
Applications
Light-curable potting materials are well suited for applications where rigid bonds or potted areas are desired. They provide translucent bonds with excellent adhesion to engineered plastics and are ideal for potting electronics, connectors, thermal switches, and sensors, as well as for tamper proofing. potting adhesives seal exposed areas with light, and also cure secondarily with activator or heat for shadow areas. Electronics potting compounds offer high adhesion to metal, glass, ceramic, and many phenolic, filled, and thermoset plastics and are ideal for bridge bonding.
Materials for Reliable Protection of Electronics Circuitry
Potting compounds cure tack free in seconds upon exposure to UV/Visible light, replacing epoxy urethane and silicone potting materials. Shallow potting and sealing of electronic components and circuitry is possible in 10-30 seconds or less. Fast cure times allow for complete in-line processing, lower labor costs, as well as large throughput increases for J.I.T. manufacturing. Additionally, the ability to cure with light eliminates the need for fixtures, jigs, racks, and ovens, increasing space and lowering total inventory costs.
Light-curable potting materials are well suited for applications where rigid bonds or potted areas are desired. They provide translucent bonds with excellent adhesion to engineered plastics and are ideal for potting electronics, connectors, thermal switches, and sensors, as well as for tamper proofing. potting adhesives seal exposed areas with light, and also cure secondarily with activator or heat for shadow areas. Electronics potting compounds offer high adhesion to metal, glass, ceramic, and many phenolic, filled, and thermoset plastics and are ideal for bridge bonding.
