Encapsulants for Microelectronic Assembly and IC Protection

UV/Visible Light Curing Protection for Bare Die, Wire Bonds & Integrated Circuits

Encapsulants cure in seconds upon exposure to UV/Visible light for protection of bare die, wire bonds, and integrated circuits (IC). These fast-curing materials help reduce processing and energy costs associated with alternative technologies. The products are all one part, so no mixing is required and viscosity is consistent. encapsulating materials have high ionic purity and resistance to humidity and thermal shock, which effectively protect components. These materials contain no sharp, abrasive mineral or glass fillers which may abrade fin wires. Their combination of low Tg and low modulus translates into low stress for bonded wires.

Light-curable electronic encapsulation materials are ideal for wire bonding, glob top, and chip-on-board applications. They may also be used on flex circuits (FPC) for encapsulating ICs, coating the circuit, or attaching it to glass or printed circuit board. The products come in a wide range of viscosities, from thin wicking to non-flowing gel. For applications where shadow areas are present,  offers dual-cure UV/Visible light and secondary ambient moisture-cure formulations .