PUR 3543 Pucons is a one-component, solvent-free moisture-curing modified polyurethane hot melt adhesive with long opening time and high initial adhesion, Low viscosity, high physical force, fast curing, strong adhesion to most plastics (PC,ABS,PMMA), glass, and metals (aluminum a

It is suitable for cell phone plastic, metal frame bonding. After assembly, the positioning strength can be achieved by pressing 20s, which is very suitable for the application of high stress and rapid positioning..

Mainly composed of alkyl-alpha-cyanoactylate, instantaneous adhesive is polymerized and cured by a small amount of moisture sucked on the surface of the adherend in a very short time (in several seconds)...

Quick curingThe instantaneous adhesive features the highest curing speed of all adhesives; curing is achieved in several seconds at a normal temperature.Excellent adhesionThe instantaneous adhesive adheres to a great variety of adherends, providing powerful adhesion comparable to

Based on the special silicone modified polymer, elastic adhesive series is a multi-function adhesive, featuring robust rubber-like elasticity and adhesiveness over an extensive range. The elastic adhesive uses a combination of flexibility and robustness to solve the problems of "b

.Adhesives formed into rubber-like elastic bodiesAbsorb external vibration and shock.Absorb thermal strain such as expansion and shrinkage (highly resistant to heat cycle).Have little stress to be concentrated on bonding interfaces.Adhere materials of different types having big di

Curing reaction is caused by moisture absorbed from the air. Pressure-sensitive range is reached in this curing process about 10 min. after application. If adherends are put together during this time, they bound instantaneously as in the case of rubber contact adhesive, eliminatin

products allow for adhesion of various types of plastics, rubbers and ceramics over an extensive range, moreover different types of metals. These products provides excellent adhesion over a very extensive range of materials, eliminating the need for selecting a particular adhesive

UV/Visible Light Curing Protection for Bare Die, Wire Bonds & Integrated CircuitsEncapsulants cure in seconds upon exposure to UV/Visible light for protection of bare die, wire bonds, and integrated circuits (IC). These fast-curing materials help reduce processing and energy costs

Light-curable electronic encapsulation materials are ideal for wire bonding, glob top, and chip-on-board applications. They may also be used on flex circuits (FPC) for encapsulating ICs, coating the circuit, or attaching it to glass or printed circuit board. The products come in a