Applications:
UV-Curable Encapsulant & Potting Resinencapsulant cures in seconds to enhance moisture, thermal cycle, and abrasion resistance of electronic and microelectronic assemblies. This material offers adhesion to various component substrates. This encapsulant provides optimal coverage ov
Features:
Light-curable potting materials are well suited for applications where rigid bonds or potted areas are desired. They provide translucent bonds with excellent adhesion to engineered plastics and are ideal for potting electronics, connectors, thermal switches, and sensors, as well a