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compounds cure tack free in seconds upon exposure to UV/Visible light, replacing epoxy urethane and silicone potting materials. Shallow potting and sealing of electronic components and circuitry is possible in 10-30 seconds or less.
Potting Compounds
Light-Curable Potting Compounds for Electronic Components
Applications:
Light-Curable Potting Compounds for Electronic Components Materials for Reliable Protection of Electronics CircuitryPotting compounds cure tack free in seconds upon exposure to UV/Visible light, replacing epoxy urethane and silicone potting materials. Shallow potting and sealing o
Features:
Light-curable potting materials are well suited for applications where rigid bonds or potted areas are desired. They provide translucent bonds with excellent adhesion to engineered plastics and are ideal for potting electronics, connectors, thermal switches, and sensors, as well a
V901
Applications:
UV-Curable Encapsulant & Potting Resinencapsulant cures in seconds to enhance moisture, thermal cycle, and abrasion resistance of electronic and microelectronic assemblies. This material offers adhesion to various component substrates. This encapsulant provides optimal coverage ov
Features:
Light-curable potting materials are well suited for applications where rigid bonds or potted areas are desired. They provide translucent bonds with excellent adhesion to engineered plastics and are ideal for potting electronics, connectors, thermal switches, and sensors, as well a