Encapsulants for Microelectronic Assembly and IC Protection UV/Visible Light Curing Protection for Bare Die, Wire Bonds & Integrated Circuits Encapsulants cure in seconds upon exposure to UV/Visible light for protection of bare die, wire bonds, and integrated circuits (IC). These

Light-curable electronic encapsulation materials are ideal for wire bonding, glob top, and chip-on-board applications. They may also be used on flex circuits (FPC) for encapsulating ICs, coating the circuit, or attaching it to glass or printed circuit board. The products come in a

Encapsulants for Microelectronic Assembly and IC ProtectionUV/Visible Light Curing Protection for Bare Die, Wire Bonds & Integrated CircuitsEncapsulants cure in seconds upon exposure to UV/Visible light for protection of bare die, wire bonds, and integrated circuits (IC). These fa

Light-curable electronic encapsulation materials are ideal for wire bonding, glob top, and chip-on-board applications. They may also be used on flex circuits (FPC) for encapsulating ICs, coating the circuit, or attaching it to glass or printed circuit board. The products come in a

Light-Curable Materials for Camera Module AssemblyFaster, Stronger Bonds for Camera Module Assemblylight-curable adhesives are ideal for use in the assembly of camera modules used in smart connected devices and automobiles, as well as security and industrial camera systems. Our ad

Typical Camera Module Applications:1 – Bonding the camera lenses2 – Fixturing the lens barrel to lens holder3 – Bonding the lens holders to the PCB (Active Alignment)4 – Flexible PCB Reinforcement..