Encapsulants for Microelectronic Assembly and IC Protection UV/Visible Light Curing Protection for Bare Die, Wire Bonds & Integrated Circuit...

Light-curable electronic encapsulation materials are ideal for wire bonding, glob top, and chip-on-board applications. They may also be used...

Encapsulants for Microelectronic Assembly and IC Protection UV/Visible Light Curing Protection for Bare Die, Wire Bonds & Integrated Circui...

Light-curable electronic encapsulation materials are ideal for wire bonding, glob top, and chip-on-board applications. They may also be used...

Light-Curable Materials for Camera Module Assembly Faster, Stronger Bonds for Camera Module Assembly light-curable adhesives are ideal for...

Typical Camera Module Applications: 1 – Bonding the camera lenses 2 – Fixturing the lens barrel to lens holder 3 – Bonding the lens holde...